The three main types of printed circuit boards are rigid, flex and rigid-flex. Rigid boards are usually made with FR4 material but they can also be fabricated with Rogers, Aluminum or other materials.
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TIn general it is always better to panelize your boards particularly when they are small. If your board length or width is less than 2 inches they must be panelized or we will require a fixture.
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The surface finish protects the copper circuitry from corrosion and provides a solderable surface for your components.
ENIG, Immersion Silver and Immersion Tin are recommended for fine pitch components including µBGAs.
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Due to a growing concern for the public health and the environment in 2006 the European Union prohibited the further use of lead in electronics also known as Restriction of Hazardous Substances in electrical and electronic equipment (RoHS). In the United States there is no law prohibiting the use of leaded solder in electronics however, many manufacturers require the use of lead free solder on their electronic devices.
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SMT components come in a variety of standardized packages including 1206, 0805, 0603, 0403, 0201, SOT, SOIC, QFP, BGA, etc. Surface mount packages are designed so that they could be easily manipulated on pick and place machines.
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Most vendors offer the same components in a wide variety of packages to accommodate different pick-and-place loading requirements. The most common options are: cut tape, reel, tube, and tray. Each packaging type has its benefits. We prefer to receive components in a tape (cut tape, partial reel or full reel).
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Every board is visually inspected after SMT and Through-hole. Every leadless components is X-rayed. All boards go through AOI and a final QC inspection.
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Improving board testing will reduce your development time and
manufacturing cost.
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