We inspect your printed circuit boards at various stages of the manufacturing/assembly process for early detection of faults. Correcting defects at an early stage improve yields during the PCB testing stage. We use visual inspection, automated optical inspection (AOI) and automated X-ray inspection. After the boards have been manufactured and have passed all the PCB assembly inspections they are ready for testing.
Common PCB assembly defects are:
- Open and short
- Insufficient or excess solder
- Missing components
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- Misaligned components
- Wrong orientation
- Defective components
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PCB assembly testing is an integral part of our manufacturing process. There is a variety
of PCB assembly testing methods. The most common ones are:
- In-Circuit Testing (ICT)
- Flying Probe Testing
- Burn-in Testing
- Functional Testing
Functional testing is the most comprehensive test to determine the pass or fail status of the printed circuit boards.
BENEFITS OF FUNCTIONAL TESTING INCLUDE
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By simulating the operating environment it eliminates the need for expensive PCB testing such ICT, flying probe and burn-in testing.
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It helps detect and correct faults at various staging of manufacturing.
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It helps to address potential issues early before going into final production, saving time and money.
We provide the following services:
- Test Planning
- Part Programming
- Custom Test Jig Development
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- Board Bring Up
- Functional Testing
- Failure Analysis
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We can help you during any stage of your process!
PROTOTYPING
First stage of the PCB, proof of concept. Focused on functionality and demonstrable product. Board bring up and debug straight off the assembly line.
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Shorts and open test on voltage rails
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Basic confirmation of functionality & 'Board Bring Up'
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Basic power test supplies for stability and spec
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Measure clocks & oscillators
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If firmware available, program devices
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Start test fixture (also known as jig) spec during this phase (You can provide your test fixture or we can develop one for you).
REV A
Fix the first issues identified in Prototyping stage. Additional features check. Expand areas of test.
- Program devices
- Unblock functionality test
- AC and DC measurement
- Jitter & accuracy
- Run diagnostics if available
- Basic environmental tests
- Test fixture development starts during this phase
REV B
Expanded test procedures to include reliability testing at temperatures to accelerate life time testing Pilot Functional Testing.
- Program devices
- Unblock functionality test with some boards
- AC and DC measurement with some boards
- Jitter &accuracy with some boards
- Run diagnostics with some boards
- Test fixture development occurs during this phase
RAMP
Expanded test procedures to include reliability testing at temperatures to accelerate life time testing Pilot Functional Testing.
- Program devices
- Unblock functionality test with some boards
- AC and DC measurement with some boards
- Jitter &accuracy with some boards
- Run diagnostics with some boards
- Test fixture development occurs during this phase
HIGH VOLUME
Failure analysis is an ongoing process throughout which ensures continuous improvements and yield.
- Start using test fixture
- Run diagnostics jig randomly pull and test some boards
- Run Functional Test
